CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

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Key Information

Due Date: November 1, 2026


Agency: United States Department of Commerce


Source: Federal


Funding Categories:

Funding Amount: Not Specified


Funding Type: Cooperative Agreement


Match Required: No


Status: Posted


Contact Info: apply@chips.gov
Misty Roosa Management Analyst

Overview

The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment.

For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.

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Key Dates

Posted Date: September 29, 2023


Application Due Date: November 1, 2026


Estimated Award Date: Not Specified

Additional Details

Eligible Applicants

  • Others

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