CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
Key Information
Due Date: November 1, 2026
Agency: United States Department of Commerce
Source: Federal
Website: View Website
Funding Categories:
Funding Amount: Not Specified
Funding Type: Cooperative Agreement
Match Required: No
Status: Posted
Misty Roosa Management Analyst
Overview
For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.
Additional Info
Posted Date: September 29, 2023
Application Due Date: November 1, 2026
Estimated Award Date: Not Specified
Eligible Applicants:
- Others
Apply with Confidence
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